World Thin Layer Deposition Equipment Market

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This report analyzes the worldwide markets for Thin Layer Deposition Equipment in Millions of US$. The major product segments analyzed are 1.Physical Vapor Deposition (PVD) Equipment (Microelectronics, Cutting Tools, Industrial, Specialty Packaging, Storage, Optics, and Medical), and 2.Chemical Vapor Deposition (CVD) Equipment (Microelectronics, Cutting Tools, Industrial, and Medical). The End-use segments discussed include Microelectronics, Cutting Tools, Industrial Applications, Specialty Packaging, Data Storage, Optoelectronic Components, and Medical Technology Applications. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2001 through 2015. A ten-year historic analysis is also provided for these markets with annual market analytics.

The report profiles 119 companies including players such as AIXTRON, Applied Materials, Inc., ASM International N.V., Axcelis Technologies, Inc., Canon ANELVA Corporation, CHA Industries, CVD Equipment Corporation, Denton Vacuum, Edwards Limited, Ibis Technology Corporation, Implant Sciences Corporation, Ionbond AG, Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services, Inc., Kokusai Semiconductor Equipment Corporation, Kookje Electric Korea Co., Ltd., Novellus Systems, Inc., OC Oerlikon Corporation AG, RIBER SA, Seki Technotron USA, SEN Corporation, Silicon Genesis Corporation, Tecvac Limited, Tegal Corporation, Ti-Coating, Inc., Tokyo Electron Limited, Ultramet, ULVAC Technologies, Inc., Vapor Technologies, Inc., and Veeco Instruments. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations I-1

Disclaimers I-2

Data Interpretation & Reporting Level I-2

Quantitative Techniques & Analytics I-3

Product Definitions and Scope of Study I-3

Physical Vapor Deposition (PVD) I-4

Chemical Vapor Deposition (CVD) I-4

End-Use Sectors - An Overview I-4

Microelectronics Industry I-4

Cutting Tools I-4

Industrial Applications I-5

Specialty Packaging I-5

Data Storage I-5

Optoelectronic Components I-5

Medical Technology Applications I-6

II. EXECUTIVE SUMMARY

1. Industry Overview II-1

A Bumpy Ride with the Economic Cycles II-1

Technology & Timing: The ˜King Makers' II-1

Putting all Eggs in One Basket? II-1

Thin Film Coating: Bouquet of Advantages II-2

CVD Vs PVD II-2

Market Risks II-2

2. Market Analysis II-3

Current & Future Analysis II-3

Analysis by Region II-3

Analysis by Technology/ End Use Segment II-3

3. Competitive Scenario II-4

Established Majors Rule Thin Film Deposition Market II-4

Co-Existing Technologies Defer Positioning II-4

Teamwork Gaining Momentum II-4

Leaders in PVD (Sputtering) Market II-5

Table 1: Leading Players in the Worldwide Sputtering

Equipment Market (2005) - Percentage Breakdown by Revenue for

Applied Materials, Novellus, Ulvac, Veeco and Others

(includes corresponding Graph/Chart) II-5

Leaders in Regional Sputtering Markets II-5

Table 2: Sputtering Equipment Market Leaders in Americas

(2005) - Percentage Breakdown by Revenue for Applied

Materials, Novellus Systems, Veeco, and Others (includes

corresponding Graph/Chart) II-5

Table 3: Sputtering Equipment Market Leaders in Japan (2005)

- Percentage Breakdown by Revenue for Applied Materials,

Ulvac,Canon Anelva, and Others (includes corresponding

Graph/Chart) II-5

Table 4: Sputtering Equipment Market Leaders in Taiwan

(2005) - Percentage Breakdown by Revenue for Applied

Materials, Novellus Systems, and Others (includes

corresponding Graph/Chart) II-6

Table 5: Sputtering Equipment Market Leaders in Rest of

Asia-Pacific (2005) - Percentage Breakdown by Revenue for

Applied Materials, Veeco, Unaxis, and Others (includes

corresponding Graph/Chart) II-6

Table 6: Sputtering Equipment Market Leaders in Europe,

Middle East and Africa (2005) - Percentage Breakdown by

Revenue for Applied Materials, Novellus Systems, Unaxis, and

Others (includes corresponding Graph/Chart) II-6

CVD Market Leaders II-6

Table 7: Leading Players in the Worldwide Chemical Vapor

Deposition (CVD) Equipment Market (2005) - Percentage

Breakdown by Revenue for Applied Materials, Novellus, Tokyo

Electron, and Others (includes corresponding Graph/Chart) II-7

LDP-CVD Market II-7

Table 8: Leading Players in the Worldwide LDP-CVD Market

(2005) - Percentage Breakdown by Revenue for Applied

Materials, Novellus, ASM International, and Others (includes

corresponding Graph/Chart) II-7

Plasma Enhanced CVD (PE CVD) Market Leaders II-7

Table 9: Leading Players In The Worldwide Plasma Enhanced CVD

Market (2005) - Percentage Breakdown by Market Share For

Applied Materials, Novellus, Asmi, and Others (includes

corresponding Graph/Chart) II-7

High Density Plasma CVD (HDP CVD) Market Leaders II-8

Table 10: Leading Players In The Worldwide High Density

Plasma CVD Market (2005) - Percentage Breakdown By Market

Share For Applied Materials And Novellus II-8

Non-Tube CVD Market Leaders II-8

Table 11: Leading Players in the Worldwide Non-Tube CVD

Market (2004 & 2005) - Percentage Breakdown by Market Share

for Applied Materials, Novellus,Tokyo Electron Ltd., ASMI,

and Others (includes corresponding Graph/Chart) II-8

Low Pressure CVD (LP CVD) Market Leaders II-9

Table 12: Leading Players in the Worldwide Low Pressure CVD

Market (2004 & 2005) - Percentage Breakdown by Market Share

for Applied Materials, Tokyo Electron Ltd., Novellus, ASMI,

and Others (includes corresponding Graph/Chart) II-9

Sub-Atmospheric CVD (SA CVD) Market Leaders II-9

Table 13: Leading Players in the Worldwide Sub-Atmospheric

CVD Market (2004 & 2005) - Percentage Breakdown by Market for

Applied Materials and Aviza Technology II-9

4. End Use Markets II-10

A Peek into TFD Materials & Technologies for Various Industry

Segments II-10

Microelectronics Industry II-11

Driven by IT II-11

Integrated Metrology: A Rising Trend II-11

Semiconductor Industry II-11

Applications of CVD and PVD Technologies II-12

Key TFD Technologies Employed II-12

Optoelectronic Components II-12

Applications of TFD Equipment II-12

CVD Equipment & Thin Film Materials for the FPD Industry II-13

Key Technologies II-13

Trends II-13

Digital/HDLCD TVs Spike PECVD Systems' Use in Flat Panel

Display Industry II-13

OLED: ˜The Future' of TFD in FPDs II-13

Medical Technology II-13

Surgical Tools - A Host of Performance Parameters to Satisfy II-14

Orthopedic Prostheses - A Quest for Higher S Quality of Life II-14

Biocompatibility - A Key Stipulation II-14

TFD Techniques Used II-14

Process Fallacies to be Addressed II-14

Other Areas of Application II-15

Major Influencers II-15

Industrial Market II-15

Key TFD Technologies Used II-15

Automotive & Architectural Glass - A Major End Use II-15

High Concentration of Glass Manufacturers - Depriving Margins II-16

Industrial Machining - High Volume Applications II-16

Critical Requirements of Tool Coatings II-16

Decorative Coatings: Bountiful Opportunities II-16

Major Influencers II-16

Cutting Tools II-16

Trends II-16

Cost-Efficiency Expands the Volume of Cutting Tools Coated II-16

Chromium Nitride Emerges the Preferred Coating II-17

Thin Film Diamond Coatings for the ˜Cutting Edge' II-17

Dry Cutting Props TFD Coatings II-17

Data Storage II-17

Trends II-17

High-Volume End Use Applications Shape the Data Storage

Industry's Demand II-17

High-Density Thin Films Improve Areal Densities of Magnetic

Recording Heads II-18

Optics Industry II-18

Specialty Packaging II-18

Typical Structure of a Flexible Package II-18

Package Productivity Rises with Thin Film Coating II-19

Market Drivers II-19

Demand for Consumer Goods & State of Economy II-19

Package Innovations & Consumer Preferences for Package

Convenience and Shelf Life II-19

Package's Visual Appeal II-19

E-Commerce II-19

Labeling Requirements II-20

Recyclability of Package II-20

Other Applications II-20

5. Product/Technology Overview II-21

Thin Layer Deposition: An Introduction II-21

Role of Evaporation in Thin Layer Deposition II-21

Deposition Techniques by Technology Type II-21

Physical Vapor Deposition (PVD): A Technical Run-through II-21

Advantages II-22

Disadvantages II-22

Sputtering: An Enabling PVD Process II-22

Sputtering Materials II-22

Types of Spluttering II-23

DC Diode Sputtering II-23

Radio-Frequency RF Diode Sputtering II-23

DC and RF Magnetron Sputtering II-23

Ion Beam Sputtering II-23

Chemical Vapor Deposition (CVD): A Technical Overview II-23

Advantages II-24

Types II-24

Atmospheric Pressure Chemical Vapor Deposition (APCVD) II-24

Low Pressure Chemical Vapor Deposition (LPCVD) II-24

Rapid Thermal Chemical Vapor Deposition (RTCVD) II-24

Plasma Enhanced Chemical Vapor Deposition (PECVD) II-25

High-Density Plasma Chemical Vapor Deposition (HDPCVD) II-25

Metal Organic Chemical Vapor Deposition (MOCVD) II-25

Atomic Layer Deposition (ALD) II-25

Advantages of ALD II-26

End-Use Application Areas II-26

Capacitor layers II-26

Gate dielectrics II-26

Interconnects II-26

Non-Semiconductor Applications II-26

Electrochemical Deposition (ECD) II-26

Other Deposition Techniques II-27

Epitaxy II-27

Molecular Beam Epitaxy (MBE) II-27

Ion Beam Deposition (IBD) II-27

Ion Implantation II-28

Types of Ion Implantation Tools II-28

Pulsed Plasma Doping: A Generation-X Ion Implantation

Technology II-28

A Quick Primer on Etching II-29

Chemical Etch II-29

Plasma Etch II-29

6. Recent Industry Activity II-30

IHI Acquires Hauzer Techno Coating II-30

Veeco Acquires Mill Lane Engineering II-30

Oerlikon Balzers Completes Acquisition of Suomen Plasmapinta II-30

Applied Materials Acquires Baccini II-30

AIXTRON to Supply GaAs MOCVD System to Korea Advanced Nano Fab

Center II-30

Tegal Corporation Wins an Order for Endeavor AT PVD Tool II-31

Oerlikon and PT. Artoda Form Joint Venture for New Coating

Center in Jakarta II-31

Tegal Selects WESI for Distribution of PVD and Plasma Etch

Products II-31

Next Solar to Build Thin-Film Solar Module Facility II-32

Tokyo Electron Enters into a Joint Venture with Sharp II-32

ASMI Receives Indicative Unsolicited Offer from Applied Materials II-32

GT Solar Enters into a Contract with The Silicon Mine II-32

Beneq Takes Over Planar Systems' ALD Business II-33

INFICON Completes Acquisition of Maxtek II-33

EPOD Acquires Majority Stake in ICP Solar Technologies II-33

SANYO Completes Acquisition of AIXTRON MOCVD System II-34

Plastic Logic Acquires AIXTRON Gen 3.5 Deposition Tool II-34

Aixtron Takes Over Nanoinstruments II-34

Oerlikon Balzers Opens Coating Centers in Turkey and Romania II-35

CVD Inks Contract to Expand First Nano Laboratory II-35

Tokyo Electron Inks Agreement with Integrated Materials II-35

Tegal to Supply Endeavor to Major Accelerometer & Inertial

Sensor Maker II-35

Tegal Receives Repeat Order for Endeavor from U.S. Customer II-36

InterCrossIP Enters into Licensing Agreements with Ceimig and SFU II-36

Williams Advanced Materials Sets Up New Facility in Czech

Republic II-36

Applied Materials Sets Up a New Wafer Reclaim Facility in Taiwan II-37

ASM Obtains Order for Multiple System Contract II-37

Tegal Wins Order for Endeavor PVD System from Major MEMS Foundry II-38

JUSUNG Signs Agreement with CEA for Joint Development of Solar

Cells II-38

CSP Partners with ULVAC for Thin Film Solar Cells II-38

Sunner Solar Partners with ULVAC to Produce Thin Film Solar Cells II-38

Amtech Enters into a License Deal with PST II-39

GE Global Research Enters into a Joint Agreement with TOKKI II-39

Epistar Purchases Five Reactors from AIXTRON II-39

Applied Materials Leads Low k Technology with Black Diamond II II-40

Balzers Changes Name to Oerlikon Balzers Coating II-40

ASM Europe to Supply Vertical Furnaces to Taiwan's Inotera

Memories II-40

Balzers Inaugurates Coating Center in Houston II-41

Williams Advanced Materials Purchases Cerac II-41

Balzers Acquires PVD Coating Operations II-41

Applied Materials Acquires Applied Films II-41

Veeco Instruments Partners with Fluens II-41

Kopin® Inks an Accord with Aixtron II-41

APA Divests Business Unit II-41

7. Product Innovations/ Introductions II-42

Oerlikon Balzers Introduces Low-temperature PVD Coatings II-42

Tokyo Electron Introduces Trias HP Ti II-42

Applied Materials Launches Applied Producer® BLOk II PECVD

System II-42

ASM International Launches Eagle® XP Platform II-43

Applied Materials Introduces Applied SunFab Thin Film Line II-43

Applied Materials Launches Applied Producer® ACE SACVD® System II-43

Axcelis Launches Optima XE High Energy Ion Implanter II-44

First Nano Launches ET2000-SS and ET3000-SS Solid Source

Deposition System II-44

Novellus Launches VECTOR Extreme PECVD System II-44

Denton Launches Discovery 785 Deposition System II-44

Tokyo Electron Rolls out Trias High-k CVD System II-45

Novellus Systems Unveils Vector Express II-45

Veeco Unveils TurboDisc K-series MOCVD Platform II-45

Veeco Instruments Introduces New Vapor Deposition System II-45

Applied Materials Unveils AKT-PiVot Deposition System II-45

Veeco Launches PV-Series of Thermal Deposition Sources II-46

Applied Materials Introduces Advanced Strain Engineering

Technology II-46

Oerlikon Balzers Introduces BALINIT® ALDURA Coatings for

Cutting Tools II-46

ASM Announces Availability of Pulsar® ALCVD Module for Volume

Production II-47

Novellus Introduces Enhancement for INOVA® 300 mm System II-47

Novellus Introduces Vector Express with AHM Technology II-47

Applied Materials Launches Applied Producer® GT II-47

sp3 Unveils Advanced Diamond Deposition System II-48

IMEC and Applied Materials Introduce 22nm, 32nm Interconnects II-48

ASM Introduces Stellar 3000 Multi-Chamber PEALD Tool II-48

Tokyo Electron Launches Trias LT Ti/TiN II-49

Tokyo Electron Unveils TELINDY IRad II-49

Oerlikon Balzers Introduces P3e Technology for Cutting Tools II-49

Applied Materials Introduces Endura® iLB II for 45nm Contacts II-50

Applied Materials Announces Applied Producer® APF-e (1) System II-50

Ionbond Introduces Thermal Diffusion Coatings II-50

Jusung Develops Semi-Batch LP CVD process II-50

French Inventors Develop A New Thin Layer Deposition Process II-51

8. Focus on Select Players II-52

AIXTRON (Germany) II-52

Applied Materials, Inc. (USA) II-52

ASM International N.V. (The Netherlands) II-52

Axcelis Technologies, Inc. (USA) II-53

Canon ANELVA Corporation (Japan) II-53

CHA Industries (USA) II-53

CVD Equipment Corporation (USA) II-54

Denton Vacuum (USA) II-54

Edwards Limited (UK) II-55

Ibis Technology Corporation (USA) II-55

Implant Sciences Corporation (USA) II-55

Ionbond AG (Switzerland) II-55

Jusung Engineering Co., Ltd. (Korea) II-56

KDF Electronic & Vacuum Services, Inc. (USA) II-56

Kokusai Semiconductor Equipment Corporation (USA) II-57

Kookje Electric Korea Co., Ltd. (Korea) II-57

Novellus Systems, Inc. (USA) II-57

OC Oerlikon Corporation AG (Switzerland) II-58

RIBER SA (France) II-58

Seki Technotron USA (USA) II-58

SEN Corporation (Japan) II-59

Silicon Genesis Corporation (USA) II-59

Tecvac Limited (UK) II-59

Tegal Corporation (USA) II-60

Ti-Coating, Inc. (USA) II-60

Tokyo Electron Limited (TEL) II-60

Ultramet (USA) II-60

ULVAC Technologies, Inc. (USA) II-61

Vapor Technologies, Inc. (USA) II-61

Veeco Instruments (USA) II-61

9.