IBM, Chartered, GLOBALFOUNDRIES, Infineon, Samsung and STMicroelectronics Expand Technology Agreements
EAST FISHKILL, N.Y., April 16 /PRNewswire-FirstCall/ -- In a move that signals a firm and ongoing commitment to advanced semiconductor technology leadership, IBM (NYSE: IBM), Chartered Semiconductor Manufacturing Ltd. (Nasdaq: CHRT and SGX-ST: Chartered), GLOBALFOUNDRIES, Infineon Technologies (FSE/NYSE: IFX), Samsung Electronics, Co., Ltd., and STMicroelectronics (NYSE: STM) have defined and are jointly developing a 28-nanometer (nm), high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology.
(Logo: http://www.newscom.com/cgi-bin/prnh/20090416/IBMLOGO)
The low-power, 28nm technology platform can provide power-performance and time-to-market advantages for producers of a broad range of power-sensitive mobile and consumer electronics applications, including the fast-growing mobile Internet device market segment. The favorable leakage characteristics of the HKMG technology result in optimized battery life for the next generation of mobile products.
This announcement represents an extension of existing joint development agreements, and further progression in the technology offerings of the alliance partners, building on the success of earlier joint development work in 32nm HKMG technology.
A 28nm low-power technology evaluation kit was previously made available in December 2008 to early access clients, followed by release in March 2009 of an evaluation kit for open access to the general marketplace. Early risk production is anticipated in the second half of 2010.
Already working with clients on 32nm low-power technology, the alliance has gained valuable experience in the implementation of HKMG technology, and is offering a migration path from 32nm to 28nm technology. Clients can begin their designs today in leadership 32nm HKMG technology and then transition to 28nm technology for density and power advantages, without the need for a major redesign. By assuring a path from 32nm to 28nm technology, this migration methodology offers clients lower risk, reduced cost and faster time-to-market.
'Through this collaboration, IBM and its alliance partners are helping to accelerate development of next-generation technology to achieve high-performance, energy-efficient chips at the 28nm process level, maintaining our focus on technology leadership for our clients and partners,' said Gary Patton, vice president for IBM's Semiconductor Research and Development Center on behalf of the technology alliance.
