SHANGHAI, June 30 /PRNewswire-Asia/ -- Semiconductor Manufacturing
International Corporation ('SMIC'; NYSE: SMI and SEHK: 0981.HK) today
announced the successful completion of its first 45-nanometer high performance
(GP, generic process with high performance) yield lot.
SMIC's high-speed, high performance 45nm GP technology integrates a
silicon germanium stress module into the design, allowing the device to run
faster, making it ideal for a number of applications, including system-on-chip,
graphics and network processors, telecommunications and wireless consumer
products, and serves as a technology platform for the fast growing China
market.
The 45nm GP technology bookends with SMIC's silicon success on its 45nm
low power (LP) technology, which is suitable for mobile devices that put a
premium on low power consumption. SMIC signed an agreement with International
Business Machines (IBM) to license its low-power and high-performance bulk
CMOS technologies in December 2007. The GP technology transfer was completed
in March 2009.
'I'm delighted with the progress of SMIC's 45nm project team, which
continues to meet rigorous deadlines, and we appreciate the excellent support
from IBM throughout this progress,' said Dr. Robert Tsu, SMIC's 45nm project
leader and Associate Vice President of Logic Technology. 'Integrating the
silicon germanium process and achieving a well-yielded test chip from the very
first yield lot is a significant technical accomplishment, and these
accomplishments allow SMIC to provide a highly manufacturable technology to
our customers.'
SMIC's 45nm GP technology is supported by a proven design-in SPICE model
and in-house design IP capability that enables customers to begin prototype
product design and plan for early time-to-market. In June, SMIC announced the
adoption of new SPICE model software for the design and verification of 45nm
IP blocks, I/O circuitry, and standard cell characterization flows.
As the company's 65nm low-power technology development cycle comes to a
successful close, with a recently completed IP portfolio, multiple customer
product qualification, and a ramping up of production, efforts have focused on
45nm. The readiness of SMIC's 45nm LP and GP technologies for design-in allows
customers to enter a premium-value market.
'We are very excited and encouraged by the completion of our first 45nm
high performance yield lot, another important signpost in SMIC's strategic
plan,' said Dr. Richard Chang, SMIC's President and CEO.