(Source: PRNewswire)
MOUNTAIN VIEW, Calif., Aug. 20 /PRNewswire/ -- Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology, Inc. with the 2009 Global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including through mold via package on package (TMV(TM) PoP), FusionQuad , and flip chip molded ball grid array (FCMBGA). Amkor delivers tailored, application-specific package design, as well as assembly and test solutions, and is a leading source for many of its customers' integrated circuit (IC) packaging assembly and test requirements.
(Logo: http://www.newscom.com/cgi-bin/prnh/20081117/FSLOGO)
FusionQuad represents a breakthrough in lead frame-based plastic packaging, which provides a cost-effective platform for increased lead counts in a standard QFP form factor. FusionQuad provides excellent electrical and thermal performance along with a reduction in packaging size. FusionQuad applications include a wide range of devices such as hard disk drives, laptop PCs, Ethernet communication, digital television, and data conversion. It offers outstanding performance in a high-density, cost-effective, lead frame plastic package.
"FCMBGA is the advanced and improved version of Amkor's Super Flip Chip (SuperFC ) high performance platform," says Frost & Sullivan Research Analyst, Karthik Kamalakannan. "This technology provides multiple benefits, including improved board space usage, by allowing closer spacing between passive components and the flip chip die resulting in smaller body size and cost savings."
Other benefits of FCMBGA are reduced warpage, enabling use of thin core substrates, and improved solder joint reliability. This packaging technology's flexibility makes it a reliable solution in applications that require robust and cost-effective high pin count flip chip packaging in harsh thermal applications. FCMBGA is targeted for use in networking and storage, gaming, broadband communications, computer, multimedia, and many other applications.
TMV(TM) PoP, Amkor's latest offering, is a novel product for next generation package on package applications. It is designed to address challenging 3D architecture requirements in handheld multimedia products enabling higher signal processing and memory densities. TMV(TM) PoP provides superior interconnect and form factor benefits to IC and system designers alike.
"TMV(TM) PoP allows for thinner bottom packages that offer a larger die-to-package ratio, and has shown significant improvement in warpage control with up to a 30 percent increase in die-to-package size," notes Karthik.
