Oct. 8, 2009 (GlobeNewswire) --
IRVINE, Calif., Oct. 8, 2009 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC) a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, announced today that Congress has appropriated $2 million to allow Microsemi's Power Products Group in Bend, Oregon, to develop critical silicon carbide-based components for data communications systems on new and upgraded Air Force platforms.
News of the Congressional funding came from Washington in an announcement by Oregon U.S. Senators Jeff Merkley and Ron Wyden of the passing of a defense appropriations bill late Tuesday night that includes Microsemi's on-going development of next generation silicon carbide RF components.
This commitment by the Air Force and Congress will further the development of SiC technology supporting future designs of lighter and more efficient jet fighter communications systems.
SiC brings several advantages in avionics applications, including increased reliability, extended battlespace coverage, point-of-use power conversion, and reduced size and cooling requirements. SiC plays a key role as battlefields become more networked and the demands for expanded bandwidth and high operation significantly increase.
According to James J. Peterson, Microsemi president, "Microsemi is committed to leading the development of silicon carbide components at our Bend operations that will enable advanced communications for both defense and commercial applications."
About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications.