PCB Electrolytic Plating -- MICROFILL EVF Via Fill provides greatly enhanced via filling at exceptionally low surface thicknesses and is capable of simultaneous through-hole plating. It is suitable for both HDI and IC (Integrated Circuit) Substrate applications. The company received an Outstanding Paper Award at recent IMPACT Conference for its excellent achievement in this area. COPPER GLEAM HV-101 and HVS-202 Acid Copper provide high plating efficiency which increases productivity and lowers plating cost for vertical continuous plating applications. COPPER GLEAM MV-100 Acid Copper exhibits exceptionally good metal distribution and better performance for vertical in-line equipment with dramatic improvement in cycle time.
PCB Making Holes Conductive -- CIRCUPOSIT 3350-1 Electroless Copper offers excellent plating coverage and reliability, stable operation, and reduced chemical consumption and waste generation for MLB (Multi-Layer Board) and HDI applications. CIRCUPOSIT 7800 Desmear for SAP (Semi-additive Process) delivers uniform and stable adhesion promotion treatment and reliable via bottom cleaning. It provides excellent plating coverage, high peeling strength and reliability. A new Advanced Sweller product provides cost-effective, wide operational window desmearing solutions for both normal and high performance laminates with reduced toxicity solvent and low concentration chemistry. CIRCUPOSIT 3323A Conditioner is a biodegradable conditioner for PTH (Plating Through Hole) processes. Its excellent coverage and lower surface tension provide exceptional performance and reliability.
PCB Final Finish -- PALLAMERSE SMT 2000 Electroless Palladium is designed for use in ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) processes for both SMT (Surface Mount Technology) soldering and gold wire bonding assembly applications. A new Low Gold Immersion Gold offers a highly economical immersion gold option for ENIG (Electroless Nickel Immersion Gold) processes.
