Taiwan, Oct. 28, 2009 (PRNewswire-Asia-FirstCall) -- Siliconware Precision Industries Co., Ltd. ("SPIL" or the "Company") (Taiwan Stock Exchange: 2325; Nasdaq: SPIL) today announced that its sales revenues for the third quarter of 2009 were NT$ 16,733 million, which represented a 18.4% increase in revenues compared to the second quarter of 2009 and a 3.0% decline in revenues compared to the third quarter of 2008. SPIL reported a net income of NT$ 2,561 million for the third quarter of 2009, compared with a net income of NT$ 1,664 million and a net income of NT$ 3,186 million for the second quarter of 2009 and the third quarter of 2008, respectively. Diluted earnings per ordinary share for this quarter was NT$ 0.82, and diluted earnings per ADS was US$ 0.13.

    Operating results review:

-- For the third quarter of 2009, net revenues from IC packaging were NT$
15,322 million and represented 91% of total net revenues. Net revenues
from testing operations were NT$ 1,411 million and represented 9% of
total net revenues.
-- Cost of goods sold was NT$ 12,856 million, representing an increase of
14.7% compared to the second quarter of 2009 and a decrease of 2.5%
compared to the third quarter of 2008.
-- Raw materials costs were NT$ 7,610 million for the third quarter of
2009, and represented 45.5% of total net revenues, whereas raw
materials costs were NT$ 6,470 million and represented 45.8% of
total net revenues for the second quarter of 2009.
-- The accrued expenses of bonuses to employees accounted for under
cost of goods sold totaled NT$ 203 million.
-- Gross profit was NT$ 3,877 million for the third quarter of 2009,
representing a gross margin of 23.2%, which increased from a gross
margin of 20.7% for the second quarter of 2009 and was down from 23.4%
for the third quarter of 2008.
-- Total operating expenses for the third quarter of 2009 were NT$ 829
million, which included selling expenses of NT$ 194 million,
administrative expenses of NT$ 292 million and R&D expenses of NT$ 343
million. Total operating expenses represented 5.0% of total net
revenues for the third quarter of 2009.
-- In the third quarter of 2009, the accrued expenses of bonuses to
employees, directors and supervisors accounting for under operating
expenses totaled NT$ 76 million.
-- Operating income was NT$ 3,048 million for the third quarter of 2009,
representing an operating margin of 18.2% for the third quarter of
2009, which increased from 15.6% for the second quarter of 2009 and
increased from 18.0% for the third quarter of 2008.
-- Non-operating items:
-- Our net currency exchange loss of NT$ 123 million for the third
quarter of 2009 was mainly due to depreciation of our US dollar
denominated asset as a result of an depreciation in the foreign
currency exchange rate of the US dollar against NT dollar, our
reporting currency.
-- Our net gain on long-term investment of NT$ 142 million for the
third quarter of 2009 was primarily due to investment gain from SPIL
BVI.
-- Net income before tax was NT$ 3,105 million for the third quarter of
2009, which increased from a net income of NT$ 2,150 million for the
second quarter of 2009 and decreased from a net income of NT$ 3,487
million for the third quarter of 2008.
-- Income tax expense was NT$ 544 million for the third quarter of 2009,
compared with income tax expense of NT$ 486 million for the second
quarter of 2009 and income tax expense of NT$ 301 million for the third
quarter of 2008.
-- Net income was NT$ 2,561 million for the third quarter of 2009, which
increased from a net income of NT$ 1,664 million for the second quarter
of 2009 and decreased from a net income of NT$ 3,186 million for the
third quarter of 2008.
-- Total number of shares outstanding was 3,127 million shares as of Sept
30,2009. Diluted earnings per ordinary share for this quarter was NT$
0.82, or US$ 0.13 per ADS.

Capital expenditure and balance sheet highlight:

-- Our cash balances totaled NT$ 17,427 million as of Sept 30, 2009 from
NT$ 19,123 million as of Jun 30, 2009, and NT$ 13,512 million as of
Sept 30, 2008.
-- Capital expenditures for the third quarter of 2009 totaled NT$ 1,070
million, which included NT$ 566 million for packaging equipment and NT$
504 million for testing equipment.
-- Total depreciation expenses for the third quarter of 2009 totaled NT$
1,916 million, which included NT$ 1,441 million was from packaging
operations and NT$ 475 million from testing operations.

IC packaging service:

-- Net revenues from IC packaging operations were NT$ 15,322 million for
the third quarter of 2009, which represented an increase of NT$ 2,320
million or 17.8% compared to the second quarter of 2009.
-- Substrate-based packaging, leadframe-based packaging and wafer bumping
& FCBGA accounted for 44%, 29% and 16%, respectively, of total net
revenues for the second quarter of 2009.
-- Capital expenditures for IC packaging operations totaled NT$ 566
million for the third quarter of 2009, which included NT$ 521 million
for packaging and building construction and NT$ 45 million for wafer
bumping operations.
-- As of Sept 30, 2009 we had 4,909 wirebonders installed, of which 250
were added and 39 were disposed in the third quarter of 2009.

IC testing service:

-- Net revenues from testing operations were NT$ 1,411 million for the
third quarter of 2009, which represented an increase of NT$ 276 million
or 24.3% compared to the second quarter of 2009.
-- Capital expenditures for testing operations totaled NT$ 504 million for
the third quarter of 2009.
-- As of Sept 30, 2009 we had 381 testers installed, of which 6 were added
in the third quarter of 2009.

Revenue Analysis

Breakdown by end applications:

By application                             3Q09              2Q09
Computing                                   22%               23%
Communication                               47%               48%
Consumer                                    19%               18%
Memory                                      12%               11%

Breakdown by packaging type:

By packaging type                          3Q09               2Q09
Bumping & FCBGA                             16%                15%
Substrate Based                             44%                46%
Leadframe Based                             29%                29%
Testing                                      9%                 8%
Others                                       2%                 2%

About SPIL

Siliconware Precision Industries Ltd. ("SPIL")(Nasdaq: SPIL; Taiwan Stock Exchange: 2325) is a leading provider of comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all of its customers' integrated circuit packaging and testing requirements, with turnkey solutions that range from design consultations, modeling and simulations, wafer bumping, wafer probe and sort, package assembly, final test, burn-in, to drop ship. Products include advanced leadframe and substrate packages, which are widely used in personal computers, communications, Internet appliances, cellular phones, digital cameras, cable modems, personal digital assistants and LCD monitors. SPIL supplies services and support to fabless design houses, integrated device manufacturers and wafer foundries globally. For further information, visit SPIL's web site at http://www.spil.com.tw .

Safe Harbor Statement

The information herein contains forward-looking statements within the meaning of Section 27A of the U.S. Securities Act of 1933 and Section 21E of the U.S. Securities Exchange Act of 1934. We have based these forward-looking statements on our current expectation and projections about future events.