Nov. 3, 2009 (Business Wire) -- ANSYS, Inc. (Nasdaq: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced its Ansoft Academic Product bundle. The portfolio is designed for teaching and academic research related specifically to radio frequency (RF) microwave, signal integrity (SI) and electromechanical systems engineering. The bundling concept offers full commercial versions of the Ansoft family of products including the industry-standard HFSS^™, Ansoft Designer^® and Maxwell^® software. Similar in structure to the globally available ANSYS Academic Product portfolio, Ansoft Academic engineering simulation software provides incredible value, feature-rich products and scalability — for both universities and students alike.

“There’s no longer the need to choose different product capabilities from a vast list of offerings — the academic software bundle has been uniquely configured to offer everything the college, department and students require, now, without the need to add other follow-on products later,” said Paul Lethbridge, academic product strategy and planning manager at ANSYS, Inc. “In addition, students and researchers can explore beyond the limited scope of a single product capability. This alone encourages multiphysics, multi-scale thinking, leading to innovation — giving students more real-world experience and, therefore, more value when they move into industry.” Lethbridge added that the bundling concept has been designed to simplify logistics, including purchasing, licensing and deployment processes.

The Ansoft Academic Product offering is now available as two options: high-frequency (HF) and electromechanical (EM). The HF bundle, suitable for high-performance RF, microwave, millimeter-wave device simulation and signal integrity applications, includes HFSS, Q3D Extractor^®, Ansoft Designer and Nexxim^® technologies. The EM bundle is intended for the design and simulation of motors, actuators, transformers, electromechanical devices, and multi-domain systems that couple thermal, electromechanical, electromagnetic and hydraulic devices; it includes Maxwell and Simplorer^® software. Both bundles include Optimetrics^™ technology, parallel processing, and import/connectivity to many common MCAD and ECAD tools. An option is available that specifically incorporates the HFSS high-performance computing capability, which allows handling extremely large simulations.

Academic products from ANSYS are used by thousands of universities and colleges in more than 60 countries, with hundreds of thousands of users. For example, Purdue University in the United States applies the Ansoft Academic Product throughout its electromagnetic curriculum.