SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued
connectivity ecosystems, announced today that Samsung Electronics Co.,
Ltd (Samsung) has licensed SMSC's patented Inter-Chip Connectivity™
ICC enables the USB 2.0 protocol, which is now standard in billions of
electronic devices, to be delivered over short distances consuming a
fraction of the power of a traditional USB 2.0 analog interface while
retaining 100 percent software compatibility with an analog USB 2.0
connection. The High Speed Interconnect (HSIC) specification (an
addendum to the USB 2.0 specification) incorporates ICC technology.
Where applicable, such as in portable applications, the ICC technology
dramatically decreases power consumption and silicon area compared to an
analog USB 2.0 interface.
Using its ICC license with SMSC, Samsung can develop devices that are
designed to be compliant with the HSIC specification for both USB 2.0
host and USB 2.0 device applications.
About SMSC's ICC Technology
SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which
was issued to SMSC on April 20, 2010. Additional related patent
applications have been filed by SMSC in the United States and other
countries. As provided for in the appropriate agreements, USB 2.0
promoters and companies that have timely signed both the USB 2.0
Adopters Agreement and a related HSIC amendment letter may license
SMSC's ICC technology patents under reasonable and non-discriminatory
(RAND) terms. Further, SMSC's ICC technology is now available to the
industry at large through individually negotiated patent licenses from
SMSC. For information about licensing SMSC's patented ICC technology,
please visit www.smsc.com/icc.
SMSC is a leading developer of Smart Mixed-Signal Connectivity™
solutions. SMSC employs a unique systems level approach that
incorporates a broad set of technologies and intellectual property to
deliver differentiating products to its customers. The company is
focused on delivering connectivity solutions that enable the
proliferation of data in personal computers, automobiles, portable
consumer devices and other applications. SMSC's feature-rich products
drive a number of industry standards and include USB, MOST®
automotive networking, Kleer® and JukeBlox®
wireless audio, embedded system control and analog solutions, including
thermal management and RightTouch® capacitive sensing. SMSC
is headquartered in New York and has offices and research facilities in
North America, Asia, Europe and India.