Wafer-level packaging drives inspection market growth – as
demonstrated by this large order for 14 NSX Inspection Systems
Rudolph Technologies, Inc. (NASDAQ: RTEC), the leader in the high-growth
market for back-end macro defect inspection, announced today that a
large OSAT (outsourced semiconductor assembly and test) company has
placed orders for 14 NSX® Series 320 Inspection Systems. The
NSX Systems, scheduled for Q2 2012 installation, will be used for
inspection in multiple steps during wafer-level chip-scale packaging
(WLCSP) processes.
Nathan Little, vice president and general manager of Rudolph’s
Inspection Business, stated, “As confirmed by our strong order book for
this new tool, packaging and test houses want to take advantage of the
latest-generation inspection equipment to maximize throughput and
productivity. The NSX 320 System performs defect inspection, 2D bump
metrology and acquires on-the-fly defect images for maximum productivity
and flexibility. In addition, WLCSP requires flexibility for handling
substrates in a variety of formats while collecting detailed defect and
2D metrology information during the inspection process; the NSX 320
System incorporates whole wafer and film frame handling solutions to
address this requirement.”
The NSX 320 System was selected after a competitive evaluation for its
high speed and efficient, easy-to-use operating procedures, which
delivered the highest productivity and lowest cost-of-ownership of all
the tools considered.
“This order is evidence of the leading position the NSX 320 Inspection
System has established in the rapidly growing market for back-end
inspection,” Little added. “Rudolph’s R&D investments in
technology-leading products and the history we have with our back-end
customers, gives us the ability to respond to the changing requirements
in this important market segment.”
The NSX 320 System provides defect inspection for next-generation
packaging processes at full-production throughput. Automatic recipe
sharing between modules, smart wafer scheduling and in-use recipe
editing make it an extremely efficient and productive inspection tool.
Rudolph Technologies, Inc. is a worldwide leader in the design,
development, manufacture and support of defect inspection, process
control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide.