Rubicon Technology, Inc. (NASDAQ:RBCN), a leading provider of sapphire
substrates and products to the LED, semiconductor, and optical
industries, today announced that the United States Patent and Trademark
Office (USPTO) has allowed Rubicon’s patent application entitled,
“Intelligent Machines and Process for Production of Monocrystalline
Products with Goniometer Continual Feedback.” The patent covers
Rubicon’s equipment and process developed to perform in-situ orientation
of its sapphire crystals within the various fabrication tools used by
the Company.
Rubicon’s customers in the LED, SoS/RFIC and optical markets all have
specific and distinct requirements for the crystal planar orientation of
the sapphire products used in their applications. The new patented
orientation technology provides greater precision in sapphire planar
orientation and eliminates time-consuming steps by performing the
orientation at the fabrication tool. These resulting efficiencies will
ultimately translate into savings for Rubicon customers.
“Rubicon is known by many for its expertise in crystal growth
technology, but our technological leadership extends from raw material
through finished sapphire wafers,” said Raja M. Parvez, President and
CEO of Rubicon Technology. “This patent reflects one of many
technological innovations we’ve put in place to meet our customers’
exacting and evolving requirements.”
About Rubicon Technology
Rubicon Technology, Inc. is an advanced electronic materials provider
that is engaged in developing, manufacturing and selling monocrystalline
sapphire and other crystalline products for light-emitting diodes
(LEDs), radio frequency integrated circuits (RFICs), blue laser diodes,
optoelectronics and other optical applications. The Company applies its
proprietary crystal growth technology to produce very high-quality
sapphire in a form that allows for volume production of various sizes
and orientations of substrates and windows. Rubicon is a
vertically-integrated manufacturer with capabilities in crystal growth,
high precision core drilling, wafer slicing, surface lapping,
large-diameter polishing and wafer cleaning processes, which the Company
employs to convert the bulk crystal into products with the quality and
precision specified by its customers. The Company is the world leader in
larger diameter products to support next-generation LED, RFIC and
optical window applications.
Further information is available at www.rubicon-es2.com.
