http://media.marketwire.com/attachments/201211/TN-53791_Audi_NXP_med.jpgRicky Hudi, Audi AG (left) with Kurt Sievers, NXPhttp://media.marketwire.com/attachments/201007/9165_nxplogo.jpghttp://at.marketwire.com/accesstracking/AccessTrackingLogServlet?PrId=953387&ProfileId=051205&sourceType=1
EINDHOVEN, THE NETHERLANDS, and MUNICH, GERMANY -- (Marketwire) -- 11/13/12 -- Audi AG and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced at electronica 2012 that they have signed a strategic partnership for innovation. The partnership focuses on innovation speed and time to market in eight select automotive electronics application segments ranging from long-established core leadership positions of NXP's automotive business, such as in-vehicle networking and car entertainment, to emerging technologies for the connected car. This includes Car-to-X communications, telematics, Near Field Communications (NFC), and high-voltage controls for electrical vehicles.
"The partnership is another milestone in our Progressive Semiconductor Program (PSCP) and underscores the mutual trust that both corporations have built over many years," said Ricky Hudi, Chief Executive Engineer Electrics/Electronics, Audi. "In addition, NXP's strategy to provide the electronic interfaces for the connected car is smart and gives clear indications for Audi's future plans."
Experts estimate that 90 percent of all innovation in automotive is enabled by electronics, with semiconductors playing a key role, while the increasing level of connectivity to the outside world requires a strong background in adjacent businesses and technologies, such as NFC, wireless reception, radar, and telematics. Audi and NXP's collaboration acknowledges the importance of semiconductors in introducing these and other new functions to the car, with a focus on achieving new levels of driving safety and comfort, saving costs, and improving energy efficiency.
"It's a real honor to serve as a strategic innovation partner to Audi in the premium car market, and is a testament to the industry recognizing NXP's excellent customer support, commitment to deliver top quality solutions, and above all our innovation power," said Kurt Sievers, general manager, automotive business, NXP. "Our strong collaboration with Audi reinforces that NXP's focus on technologies for the connected car is spot on with where the industry is going."
NXP and Audi's partnership is part of Audi's Progressive Semiconductor Program (PSCP), the comprehensive semiconductor strategy aimed at intensifying the role and engagement of semiconductor companies in the processes of the German car manufacturer. It is entitled "Role Model of Innovation & Speed" and was signed in May 2012 by Ricky Hudi of Audi and Kurt Sievers of NXP.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2151437